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Our Basic Line
Chip-DSC 1
Differential Scanning Calorimeter
- Heat flow measurements for quality control and research
- RT up to 450 °C (no cooling options available)
- Installation through video instructions within 30 minutes
- Replaceable heat flux sensor
- Unsurpassed cooling speed thanks to "low mass" chip sensor
Dilatometer DIL L76
Expansion measurement / sintering processes / contact angle
- Thermal linear expansion from -180°C to 2400°C
- Determination of the coefficient of thermal expansion (CTE)
- Investigation of sintering behavior and sintering kinetic
- Measurements of all atmospheres (red, ox, vac, inert)
- Variable measurements from sample diameter 5mm - 30mm
THB Basic
Transient Hot Bridge method
- With new sensors and intuitive software
- Unsurpassed measurement accuracy in determining thermal conductivity
- Measurements in seconds
- Non-destructive measurements with half-shell sensor
- Compact dimensions
HCS 1
HCS-Hall Effect Measurement System
- Characterization of semiconductor devices
- Measurement of: Carrier mobility, resistivity, carrier concentration and Hall constant
- Measurement of a wide variety of materials under defined atmospheres or vacuum conditions
- Integrated software package for user-friendly operation
- Modular and upgradeable system design
LSR 1
Resistivity / Conductivity and Seebeck Coefficient
- Modular system design
- Vacuum tight measurement chamber for measurements under defined atmospheres
- Easy to use and exchangeable sample holders, with integrated primary and secondary heater
- Integrated state of the art measurement electronics provides most accurate results for challenging samples
Our customers
worldwide
